Our Products

Broad Product Portfolio - MCD Semiconductor provides the following product families in various package types from through-hole to surface mount devices as well as wafer/bare die for hybrid applications.

In addition to our extensive product portfolio of packaged parts, MCD Semiconductor also offers products in wafer/bare die to fulfill customers' demand for hybrid applications.

Full unsown wafers are available 100% tested and probed with rejects inked. Bare die is also available in waffle packs. MCD Semiconductor offers customers flexibility with special wafer diffusion, selected parts and custom devices. Contact us to discuss your specific requirements.

World Class Manufacturing Facilities.
From the front-end wafer development to back-end packaging, the biggest MCD partner has a well-established supply chain to maximize efficiency.

  • Over 2 million square feet of world class manufacturing facilities
  • Class 10,000 Clean Room
  • High level of automation and scalable capacity
  • Over 3000 employees worldwide